The WaRP7 is the next generation Wearable’s Reference Platform based on the NXP iMX7 Solo applications processor. The kit consists of 2 boards:
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A CPU board featuring the ARM Cortex-A7 based iMX7 processor, memory, power management and a combo WiFi/BLE module.
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An IO board which provides interface to variety of sensors, expansion and debugging capabilities.
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The CPU & IO boards operate in the commercial temperature range, 0°C ~ 85°C
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The LCD operates temperature range : 0°C ~ 70°C.
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The battery operates temperature range : 0°C ~ 45°C.
The features present on CPU Board are listed on CPU Board.
| Features | CPU Board |
|---|---|
Processor |
NXP iMX7S ARM Cortex-A7/Cortex-M4 |
Memory |
8GB, 8bit Embedded MMC/ 512MB LPDDR3 |
PMIC |
PF3000 PMIC and BC3770 battery charger. |
Wireless |
Combo WiFI/BLE |
Display/Camera interface |
MIPI-DSI connector / MIPI - CSI connector |
Power Source |
USB/Battery |
PCB |
38mm x 23mm / 10 layers |
Indicators |
1 - Power, 1 - User |
The features present on IO Board are listed on IO Board.
| Features | IO Board |
|---|---|
Debug Support |
JTAG, Serial Header |
Sensors |
Accelerometer, Magnetometer Pressure Sensor Gyroscope |
Audio |
Stereo codec - Mic In / Line Out |
Expansion |
MikroE Click header |
The following block diagrams show the connection present on each board and how the devices are connected.
Length |
38 mm |
Width |
23 mm |
PCB Thickness |
1.0 mm |
Main Processor: NXP MCIMX7S3DVK08SA - i.MX7S with 12mm x 12mm MAPBGA, 0.4mm.
The i.MX7S applications processor has an ARM Cortex-A7 core and an ARM Cortex-M4. The device is targeted for IoT, Wearable and general embedded markets.
The CPU Board features a Multi-Chip Package Memory 08EMCP04-EL3AV100-C30U from Kingston which combines 8GB eMMC and 512MB Low Power DDR3 synchronous dynamic RAM. This comes in 221-ball FBGA package.
The WaRP7 CPU board provides output video from MIPI-DSI and accepts input through MIPI-CSI.
The CPU board includes a MIPI-DSI connector for outputting the video from the i.MX7S MIPI-DSI PHY via the MIPI-DSI interface.
The WaRP7 board provides a number of connectivity including Wi-Fi, Bluetooth, Bluetooth (BLE), and USB-OTG. There is provision for NFC as a passive tag primarily for Bluetooth pairing.
The Murata Type 1DX module is an ultra-small module that includes 2.4GHz WLAN IEEE 802.11b/g/n and Bluetooth Version 4.1 plus EDR functionality. Based on Broadcom BCM4343W, the module provides high-efficiency RF front end circuits.
The CPU board provides an USB micro-AB connector to support USB-OTG function powered by the by USB OTG1 module on i.MX7S.
The board provides support for NFC using the NXP NT3H1101W0FHK. In addition to the passive NFC Forum compliant contactless interface, the IC features an I2C contact interface, which can communicate with i.MX7 if NTAG I2C is powered from an external power supply. An additional externally powered SRAM mapped into the memory allows a fast data transfer between the RF and I2C interfaces and vice versa, without the write cycle limitations of the EEPROM memory.
The NXP PF3000 power management integrated circuit (PMIC) features a configurable architecture that supports numerous outputs with various current ratings as well as programmable voltage and sequencing. This enables the PF3000 to power the core processor, external memory and peripherals to provide a single-chip system power solution.
The usage of PF3000 output is as shown in [PF3000 Output Power Up Sequence and Usage] below.
| PF3000 Channel | Voltage | Power up sequence | Output Current | i.MX7 Power Rail |
|---|---|---|---|---|
SW1A |
1.15 V |
1 |
1000 mA |
VDD_ARM |
SW1B |
1.15 V |
1 |
1750 mA |
VDD_SOC |
SW2 |
1.8 V |
2 |
1250 mA |
VDDA_1P8_IN FUSE_FSOURCE VDD_XTAL_1P8 VDD_ADC1_1P8 VDD_ADC2_1P8 VDD_TEMPSENOR_1P8 |
SW3 |
1.5 V |
3 |
1500 mA |
NVCC_DRAM NVCC_DRAM_CKE |
VSNVS |
3.0 V |
0 |
1 mA |
VDD_SNVS_IN |
SWBST |
- |
600 mA |
||
VREFDDR |
3 |
10 mA |
DRAM_VREF |
|
VLDO1 |
1.8 V |
2 |
100 mA |
VDD_LPSR_IN |
VLDO2 |
1.2 V |
- |
250 mA |
|
VLDO3 |
1.8 V |
2 |
100 mA |
NVCC_GPIO1/2 |
VLDO4 |
1.8 V |
- |
350 mA |
|
V33 |
3.15 V |
2 |
350 mA |
NVCC_xxx VDD_USB_OTG1_3P3_IN VDD_USB_OTG2_3P3_IN |
VCC_SD |
3.15 V |
3 |
100 mA |
NVCC_SD2 |
The following i.MX7S power rails must use the internal LDO outputs.
| i.MX7S internal LDO output | i.MX7S Power Rail |
|---|---|
VDDD_1P0_CAP |
VDD_MIPI_1P0 PCIE_VP PCIE_VP_RX PCIE_VP_TX |
VDDA_PHY_1P8 |
VDDA_MIPI_1P8 PCIE_VPH PCIE_VPH_RX PCIE_VPH_TX |
VDD_1P2_CAP |
USB_VDD_H_1P2 |
The NXP BC3770 is a fully programmable switching charger with dual-path output for single-cell Li-Ion and Li-Polymer battery. The dual-path output allows mobile applications with a fully discharged battery to boot up the system.
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High efficiency and switch-mode operation reduces heat dissipation and allows higher current capability for a given package size.
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Single input with a 20V withstanding input and charges the battery with an input current up to 2A.
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Charging parameters and operating modes are fully programmable over an I2C Interface that operates up to 400 kHz.
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Highly integrated featuring OVP and Power FETs.
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Supports 1.5 MHz switching capabilities.
Length |
38 mm |
Width |
38 mm |
PCB Thickness |
1.0 mm |
The IO board includes the NXP SGTL5000 – an ultra-low power audio codec with MIC In and Line Out capability.
The WaRP7 board includes three sensors: altimeter, accelerometer and gyroscope. These three sensor chips share the I2C bus on i.MX7S. The sensors interrupts are wired to the processor as OR circuit. The software determines which device asserted the interrupt.
The board features NXP’s MPL3115A2 precision altimeter. The MPL3115A2 is a compact piezoresistive absolute pressure sensor with an I2C interface. MPL3115 has a wide operating range of 20kPa to 110 kPa, a range that covers all surface elevations on Earth. The fully internally compensated MEMS in conjunction with an embedded high resolution 24-bit equivalent ADC provide accurate pressure [Pascals] / altitude [meters] and temperature [degrees Celsius] data.
The board also features FXOS8700CQ 6-axis sensor combines industry-leading 14-bit accelerometer and 16-bit magnetometer sensors in a small 3 x 3 x 1.2 mm QFN plastic package.
